The work being proposed involves the development of a temperature selective deposition technique for the formation of small, accurately positioned openings in a protective coating for implantable integrated circuits. Early work done in our laboratory indicates that resistors formed using conventional thin film technology can be used as heat sources during Parylene deposition to prevent the formation of a film over the heated regions, resulting in small openings having diameters as small as 3 um. Investigation of this process and the properties of the polymer coating which results from its use are being proposed.
