This Small Business Innovation Research (SBIR) Phase I Project seeks to develop an innovative method for removing resist from semiconductor wafers. The Microcavitation Resist Remover will help enable the low-k integration critical to the next generation of faster chips. Microcavitation will be a mechanical removal process influenced by the mechanical properties of fracture rather than the chemical constitution of the resist.

Resist stripping is a growing $3.7B market. The proposed Microcavitation Resist Remover and wafer cleaner succesfully overcomes a critical technological barrier facing the IC manufacturing industry today. Beyond the IC manufacturing industy, the Microcavitation Resist Remover will be critical in all areas where thin film removal is critical e.g., MEMS, PCB, optics, automotive (paint removal), and aerospace. More broadly, it will be an enabling technology for use in thin film processing. Microcavitation is a chemical free, environmentally friendly technology.

Project Start
Project End
Budget Start
2006-07-01
Budget End
2006-12-31
Support Year
Fiscal Year
2006
Total Cost
$100,000
Indirect Cost
Name
Uncopiers, Inc.
Department
Type
DUNS #
City
Manhattan
State
KS
Country
United States
Zip Code
66503