This Small Business Innovation Research (SBIR) Phase I project will initiate the development of a low cost scanning micro- Light Detection and Ranging (lidar) for commercial and humanitarian applications. A major aim is to introduce revolutionary technology that will drive down the cost of the overall micro-lidar system to the required price range for the intended applications. In order to achieve this goal, a unique monolithic imaging Focal Plane Array (FPA) will be developed, incorporating a silicon avalanche photodiode (APD) array for image detection monolithically integrated with a readout integrated circuit (ROIC). Such a device will be the first demonstration of an APD array and a ROIC integrated on a single silicon chip. This is a disruptive technology needed to drive down the cost of the overall micro-lidar system. The research objectives of the Phase I effort are to design, layout, fabricate and test individual APDs and APD arrays. The Phase I effort will also design and simulate the ROIC unit cell circuitry and fan-out electronics as well as building a prototype demonstration of the micro-lidar system.
The broader impact / commercial potential of this project will be driven by the possibility of monolithically integrating photonic and electronic components to significantly lower the cost of lidar systems. Scientific and technological understanding will be enhanced in technology areas such as integrated components, photonic devices and photonic sensors. This will open up a large range of opportunities for commercial and humanitarian applications of deep societal impact in several market sectors, such as automotive, aviation, health industry and sensory assistance to people. Two examples of such opportunities are: automotive sensors to improve vehicle safety and assisting blind people with obstacle avoidance. The automotive application has a very large potential market where few US companies are currently participating. The adoption of these sensors has the potential of creating a large number of jobs. The reduced number of collisions resulting from the use of these sensors will have a strong impact on the quality of life of many people, of course. The application to assist blind people with obstacle avoidance also offers the opportunity of significantly changing their quality of life.
Aerius developed a unique monolithic imaging readout integrated circuit (ROIC), with an integrated silicon avalanche photodiode (APD) array, in support of a low cost scanning micro-lidar product that has multiple commercial applications, including automotive automatic cruise and braking control, night vision, and obstacle assistance for the blind. Beneficiaries, in particular, could include the automotive consumer market for purposes of including accident avoidance systems into automobiles. A major aim is to introduce revolutionary technology that will drive the cost of the overall micro-lidar system down to the $100 – $200 price range and make it accessible to the markets previously indicated. In order to achieve these ambitious goals, Aerius Photonics developed a unique monolithic imaging Focal Plane Array (FPA) which incorporates a silicon avalanche photodiode (APD) array on-chip to be used for imaging detection monolithically integrated with a readout integrated circuit (ROIC). Such a device is the first demonstration of an APD array and a ROIC integrated on a single silicon chip – this is the disruptive technology needed to drive down the cost of the overall micro-lidar system enabling entrance into the commercial market place for high volume. To design the silicon APD and APD arrays, Aerius worked with its partner Arizona State University (ASU); the APDs were fabricated in a standard CMOS process at a trusted US foundry and tested at ASU and at Aerius. On the emitter side, Aerius has extensive experience with vertical cavity surface emitting laser (VCSEL) arrays. Such arrays provide sufficient power for range finding and have the important advantage in the consumer market of improved eye safety over edge emitting lasers (EELs). In Phase I, Aerius proposed the following technical objectives: Design, layout, fabricate, and test individual APDs in the 0.18?m technology at JAZZ Semiconductor. Design and simulate the ROIC unit cell circuitry and the fan-out electronics. Perform a 1-D prototype demonstration of the final Phase II 2-D system using available components from Aerius and commercial off-the-shelf parts. Aerius accomplished all of the technical objectives in Phase I. In addition, Aerius went beyond the described scope of the program, and performed additional tasks, including additional design, analysis, and characterization. As part of the effort in Phase I, Aerius provided valuable industry experience to the students and faculty involved in the project from Arizona State University (ASU). Based on the results of phase I, Aerius believes that the development can continue to the point of a successful prototype demonstration system. Industry Experience for ASU students and faculty The APD characterization was performed by a large student team at ASU that used the project as a senior project. The students were supported by a number of faculty members that teach the senior project class and support the design team during the project. Additionally, graduate student Jeff Rollins, under the supervision of Dr. Barnaby, performed dark and illuminated I-V measurements on the SiGe detectors. Graduate student Vinay Chinti assisted Dr. Barnaby with the device TCAD simulations. Graduate student Kyle LaFevre, under the supervision and Dr. Bert Vermeire and Dr. Bertan Bakkaloglu, performed the simulation and layout of the TIA IC, and the design and layout of the TIA evaluation board. Research scientist James Laux assisted in the construction of the test chip with integrated APDs and the TIA test circuit. Kyle also performed characterization of the chip. Commercial Opportunities In Phase I, Aerius continued to investigate commercial opportunities for the developed monolithic imaging ROIC. CMOS image sensors are increasing finding a home in the automotive market place. Currently, passive image sensors are being implemented in vehicles for nigh vision enhancement. From Figure 29, in 2009, the total amount of CMOS sensor sales into the automotive market place is < 2% ($78M) of the total $3.9B market. As a result of increasing introduction of 3-D Flash lidar technology into the automobile for applications such as automatic braking, and cruise control, this segment will grow in 17% of the $8.3B CMOS sensor market by 2014, with total revenue of $1.4B. This represents an 18X increase in sales in just 5 years.
