A new technique for coating surfaces using plasma-enhanced deposition followed by electroplating, forming a transitional buffering interface (TBI), provides for excellent adhesion characteristics for a wide range of base materials and very close control of film thickness, flatness, and roughness. These characteristics greatly influence the thermal contact conductance. It is proposed to investigate how the conductance varies with these parameters, and to develop a strategy to minimize contact resistance. The thermal resistance which exists between discrete objects such as those present in electronics packages poses a severe limitation on the heat which can be dissipated. A high surface conductance coating which maintains structural integrity would be highly desirable, with applications to thermal control in the aerospace and electronics industries. Successful completion of the proposed research would be a significant step in the right direction.
