This Expedited Award for Novel Research is in support of a demonstration experiment on the rapid and uniform electroplating of the inside surface of very small holes. These holes occur on densely packed printed circuit boards, and the necessary copper deposition has been either slow and uniform, or rapid and non-uniform. The proposed system induces an appropriate flow of electrolyte through the hole through a combination of pressure-driven flow and flow driven by a helically fluted electrode spinning inside the hole. The study is an exploratory assessment of this concept.
