CTS-9309530 State University of New York-Binghamton Timothy J. Singler ABSTRACT Fabrication techniques in microelectronics has outpaced developments in soldering. The process of soldering is to be examined with emphasis on greater understanding of the underlying transport phenomena. Integrated experimental and theoretical approaches will focus on joint shape prediction, solder defect analysis and reactive wetting to improve soldering technology. Soldering is important throughout the electronics industry. Advances in soldering could reduce failure rates to increase productivity or maintain performance while better addressing environmental considerations.
