Transient thermal processing is an essential step in multilayer thin film fabrication for electronic devices. Major hurdles in current thermal processing techniques are the material defects, such as warpage and slip, caused by thermal stresses due to temperature gradients in the thin-film structures. During the proposed investigation, a numerical technique will be developed to predict the temperature distribution in a multilayer thin film structure at all times during thermal processing. The technique will simulate complex geometries of films with variable optical and thermal properties, will allow for phase change, and will include stationary and variable heat sources. Parametric study following the development will focus on two emerging transient thermal processing technologies, Zone Melting Recrystallization (ZMR) and Rapid Thermal Annealing (RTA), where there is immediate need for thermal analysis. The technique will be tested experimentally on "large scale" models of the thin film structure.
