This effort is to explore the improvements in hole quality and drill life of micro-drills used in the printed circuit board manufacturing industry, by the utilization of helical points on the drills rather than planar points that are currently utilized. A new geometrical model that describes a helical point on a micro -drill will be developed. Based on this model a kinematic mechanism will be designed and fabricated to grind helical points on micro-drills. The availability of helically-pointed micro-drills is essential to explore improvements in performance and life that appear to be theoretically feasible. This feasibility is based on the fact that helical points offer a much higher clearance angle distribution along the drill's cutting edge, without weakening the edge, in comparison to planar pointed drills. This effort that deals only with micro-drills in combination with the large dollar volume of the printed circuit board industry and it's strategic importance to the electronic industry, makes this a high risk venture with a significant potential for large pay-offs.
