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Damage Tolerance in Mircoelectronic Packaging
Liu, Sheng
Wayne State University, Detroit, MI, United States
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Abstract
Funding Agency
Agency
National Science Foundation (NSF)
Institute
Division of Civil, Mechanical, and Manufacturing Innovation (CMMI)
Type
Standard Grant (Standard)
Application #
9796068
Program Officer
Ken Chong
Project Start
Project End
Budget Start
1997-01-01
Budget End
1998-12-31
Support Year
Fiscal Year
1997
Total Cost
$41,723
Indirect Cost
Institution
Name
Wayne State University
Department
Type
DUNS #
City
Detroit
State
MI
Country
United States
Zip Code
48202
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