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Surface Chemical and Thermally Activated Processes in Fatigue Crack Initiation and Microcrack Propagation
Chung, Yip-Wah
Fine, Morris
Mura, Toshio
Northwestern University at Chicago, Evanston, IL, United States
Search 26 grants from Yip-Wah Chung
Search 11 grants from Morris Fine
Search 5 grants from Toshio Mura
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Abstract
Funding Agency
Agency
National Science Foundation (NSF)
Institute
Division of Materials Research (DMR)
Application #
8617956
Program Officer
Project Start
Project End
Budget Start
1987-03-01
Budget End
1990-08-31
Support Year
Fiscal Year
1986
Total Cost
$354,000
Indirect Cost
Institution
Name
Northwestern University at Chicago
Department
Type
DUNS #
City
Evanston
State
IL
Country
United States
Zip Code
60201
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