A hierarchy of lead-free solders are scientifically designed using thermodynamic calculations of ternary and quaternary phase diagrams. Metal elements under consideration include Sn, Sb, Cu, Ag, Bi, Zn, Al, In, and Au. Solders are processed and analyzed for the phases present. Wettability, mechanical strength, and fatigue properties are measured. An iterative approach is taken to assist in the materials selection. In a later phase promising solders will be investigated with the assistance of electronic device manufacturers with funding from industry. %%% This research is aimed at creating lead-free solders for industry/environmental improvement. Processing and reliability of the solders are addressed.

Agency
National Science Foundation (NSF)
Institute
Division of Materials Research (DMR)
Application #
9201834
Program Officer
Bruce A. MacDonald
Project Start
Project End
Budget Start
1992-09-01
Budget End
1995-12-31
Support Year
Fiscal Year
1992
Total Cost
$267,000
Indirect Cost
Name
Northwestern University at Chicago
Department
Type
DUNS #
City
Evanston
State
IL
Country
United States
Zip Code
60201