Polymers play a critical role in electronic materials processing, including packaging and interconnection of electronic components, photolithography, use as passivant overcoats and interlevel insulators. The performance of an electronic device often hinges on the properties of the polymer film used in these applications. Structure-property relationships are crucial for developing new chemical systems, formulating process models and predicting end-use performance. My research interests are focused on these materials issues in electronic packaging and interconnection. Two of my ongoing research projects are: 1) Integrated Circuit Encapsulation. Rapid polymerization processes, including resin transfer molding, are employed in chip packaging operations. These processes would benefit from an on-line monitoring technique which provides instantaneous information on the state of cure and does not disturb the manufacturing process. In-situ monitoring of dielectric properties via the use of microsensors may be a valuable method for elucidating structural and mechanical properties. The goals of this study are to establish the fundamental relationships between conductivity and structural and rheological properties, and to develop a dielectric cure monitoring system for controlling the encapsulation process. 2) Non-Destructive Analysis of Polyimide Films. High performance polyimide films and coatings are required by the electronics industry. The properties of these polyimides are critical in the fabrication and performance of integrated circuits. Thermal cure history fabrication environment and type of substrate upon which the pre-polymer is cast all can have a significant effect on the chemical structure of the polymer, which in turn affects the final performance properties of the film. In this study, in-situ spectroscopic, birefringence, X-ray diffraction, thermal and dielectric analysis will be combined with microfabricated load-deflection test sites to study the processing, environmental and structural dependence of performance properties for thin polyimide films.
