9412933 Busch-Vishniac The proposal addresses (1) analytical models and (2) the development of a laboratory prototype for the evaluation of Tape Automated Bonding (TAB) bonds in a non-deductive manner. The parameters considered are bonding pressure, temperature and testing duration which are important to the semiconductor electronics industry. The proposal describes research to relate these macroscopic parameters to the predicted and measurable quality of the bond, particularly the mechanical strength of the bond and, perhaps, eventually the reliability. ***
