The objectives of this research include new experimental measurements and computational simulations of helicon plasma sources (n_e=10^11 - 10^13/cm^3) which are important for a variety of future applications. These include submicron plasma etching of wafers, processing of materials, an efficient ionization source for argon lasers, a large volume source for simulation of space-plasma experiments, a source for fusion plasma confinement experiments, a processor of nuclear waste, and as a thrustor for space vehicles. Key issues which have not been resolved to date for these sources are: 1) Mechanisms for producing fast ionizing electrons (in argon E > 16 eV) and measurements of their energy distribution function in space and time, which are key to efficient ionization in helicon sources, 2) Mechanisms for rapid spatial damping of the wave in inhomogeneous magnetic field configurations and realization of new antennas which improve source operation, 3) 2-D simulations of wave antenna coupling, linear heating, and nonlinear wave trapping processes, which can be compared with experimental observations and utilized to predict future helicon source properties which is new to the field. We have developed a new experimental facility which will utilize as diagnostics a fast response optical probe, spectroscopy of energetic argon states indicative of fast electrons, wave field, frequency spectral analysis, Langmuir probe and diamagnetic loops and network analyzer techniques to measure the matched antenna impedance. We will develop a 2-D plasma profile, finite-difference, full electromagnetic code (MAXEB) which will be compared with experimental observations. The improved understanding of the physics of plasma production and simulation techniques for these sources will provide a basis for greatly improved antenna and magnetic field source design and larger size plasma sources for a variety of applications. The close coupling of our new experimental program with simulation programs provides an exceptional opportunity for improving our knowledge for future applications in this emerging technology area. ***
