This Award will renovate the space of a materials processing laboratory to meet with standards of an Advanced Electronic Packaging Facility for the fabrication and characterization of electronic and optoelectronic packages and materials. Electronic packaging is considered to be a critical area where a significant increase in research and research training output is needed to maintain the strength of the U.S. in the 1900's and beyond. The proposed facility will be an integral part of the Industry-Cornell University Alliance for Electronic Packaging, a unique alliance between Cornell University and a diverse set of companies including IBM, Digital Equipment, Carbonundum, and AMP. Its mission is to perform both basic and pre-competitive direct research to achieve world-wide leadership in electronic packaging. Electronic packaging research at Cornell is also supported by the Semiconductor Research Corporation which is a consortium of U.S. companies organized to sponsor research in the universities to enhance the competitiveness of the U.S. The research activities supported by the Alliance and the SRC are currently growing in five key areas: architecture and design, interconnects, materials and thin films, optoelectronics, and thermal management.
