This Small Business Innovation Research (SBIR) Phase II project proposes to develop and commercialize a single step chemical mechanical polishing (CMP) process for fabrication of next generation of copper based interconnects that join millions of transistors on a chip. The current state of the art copper CMP process is complicated and requires multiple steps to meet the defect quality and planarity requirements. Furthermore, existing processes create high stresses during polishing, which may not be compatible with the fragile low dielectric constant materials are now being introduced by the semiconductor industry. To address these challenges the research team proposes to develop the "soft polishing layer" concept for gentle removal of copper that does not damage the fragile dielectric layer. The use compatible chemistries and nanoparticles in the slurry allows successful development of a flexible, defect-free, single step process to fabricate copper based interconnects that will result in substantial cost savings to the semiconductor chip manufacturers. During Phase II, the company will partner with the leading edge CMP companies and chip manufacturers to address industrial scale integration issues related to development and commercialization of the single step slurry.
With the impending introduction of new fragile ultra low k materials, CMP processes are expected to become more complicated and expensive, to achieve the necessary levels of performance. The successful implementation of the single step CMP process is expected to meet or exceed the technical performance levels of the 45 nm manufacturing node while decreasing the CMP manufacturing costs by up to 80% which translates to over $ 4 billion savings for the chip industry (10 X savings for the chip industry for every "X" dollar of slurry revenue). The reduction in costs is largely due to the simplification of the manufacturing process, higher throughput, increased yield, less use of capital equipment and manpower, and reduction in consumable costs. The successful completion of this project will help maintain and grow the country's leadership in nanotechnology, a key area for future health and vitality of the nation. This project will help increase the number and quality of manufacturing jobs in the country.
Sinmat Inc. has developed a single-step polishing process for copper-based wires that join millions of transistors on a computer chip. This innovative process simplifies electronic chip manufacturing by combining multiple, disparate Chemical Mechanical Polishing (CMP) steps into one single polishing step. The semiconductor industry is a $300 B industry and the CMP consumables market is $2 B in size. Sinmat Inc. provides innovative CMP centric semiconductor solutions through its slurry products and wafer polishing services. Slurries are an aqueous formulation (90% water and the remaining chemicals and specialty additives) used to polish (CMP) wafers that are subsequently used in the manufacturing of electronic products and devices. The semiconductor industry is continually driven to innovate and improvise. Chemical Mechanical Polishing (CMP) was introduced in the 1990s and has currently emerged as one of the most enabling steps in semiconductor manufacturing. The current state-of-the art polishing processes for copper-based wires are complicated and require multiple steps to meet semiconductor industry quality requirements. Existing processes create high stresses during polishing which may not be compatible with the fragile materials currently being used. Sinmat's "soft polishing" technology gently removes unneeded copper from the wires without damaging their delicate insulating layer. Cost reductions from this single-step CMP technology are largely due to the simplification of the manufacturing process, increased product output, and decreased use of capital equipment. The gentle approach may reduce polishing process costs by up to 40%, which translates to over $1 B in overall savings for the computer chip industry. Sinmat is currently commercializing this CMP technology with top chip manufacturers around the world. The successful commercialization will extend our country’s leadership in nanotechnology and semiconductor manufacturing; key areas for the nation's future economic health. Sinmat Inc. received this NSF SBIR Phase II grant in 2006, and in the last six years, the company has transformed itself from a fledgling start-up to a semi-commercial entity. Sinmat has grown from 4 employees in 2006 to 20 employees in 2012. The company’s revenues have grown five-fold with year over year average growth of 40% in the last 3 years. Back in 2006, Sinmat had zero products and zero commercial sales, and currently it has more than 15 slurry products and multi-million dollar commercial sales. Sinmat has more than 40 customers worldwide with some of them being Global Fortune 500 companies. Sinmat’s customers are spread across the US, Europe and Asia (Japan and Korea). The company is a rare example of a US based and operated entity that makes "products manufactured in the US and exported to Asia and Europe." The organic growth has helped the company to move to a new R&D and manufacturing facility in 2011. Sinmat has been mentioned in the local and national media with even President Obama mentioning Sinmat (in 2009) as one of the emerging companies in the clean technology area. The company has won the 2009 Governor’s Innovation Award for the state of Florida, and two consecutive R&D 100 awards for CMP technologies in 2008 and 2009. The R&D 100 award is given to the 100 most innovative technologies introduced to the marketplace. The company has its innovative CMP products protect by 20 new patents, applied for or granted in the last six years. It has presented the results of its research in conferences and journal publications. In addition to public dissemination, Sinmat has also provided invaluable internship opportunities to undergraduate students who have later found jobs in Fortune 500 companies.
