This SBIR Phase I project will develop model-based control of electro-chemical mechanical planarization systems used for future generations of semiconductor manufacturing. The model-based control will incorporate critical system knowledge to improve wafer uniformity and system throughput.
The successful completion of this project will assist in the adoption new dielectric structures for next generation electronic devices. It may also enhance the understanding of electropolishing and electroplating processes. Optimization of the processes will also reduce environmentally sensitive waste.
