Complex digital systems are typically prototyped using large arrays of PWB/rack mounted field programmable gate arrays (FPGAs), a lengthy and costly task. This project will utilize a 3D IC stack containing 32 to 128 FPGAs on an active substrate that occupies approximately 1 cubic centimeter and provides all the logic, interconnect and I/O necessary to prototype a complex computational system. Due to the close proximity of the ICs to each other and to the active substrate, significant power, speed and reliability improvements over conventional prototyping boards are possible. Existing FPGA programming tools can be extended to provide quick turn-around design/programming of this system. Using this concept, prototyping time can be significantly reduced. This is especially useful in: redesign/re-prototyping situations where the design must be rapidly modified; hardware based simulation accelerators; shared resource situations where one prototype system must (could) be shared among several programs; and low-quantity custom systems where the "prototype" could become the "product". The Rapid Prototyping Module (RPM) will provide significant advantages in development cost and time-to-market for those companies having access to this technology.
