The project concerns an augmented hydrostatic extrusion process for the production of fine wire, less than one mil in diameter, needed for the bonding of microchips. Results from earlier work led to a detailed understanding of the factors limiting the productivity of this process and a prototype laboratory unit has verified the effectiveness of appropriate control procedures in overcoming these limitations. An integrated system for clean room operation will be designed. The prototype will demonstrate both the economic advantages of the augmented hydrostatic extrusion process and the reliability and quality of the wire produced.
