This Small Business Innovation Research (SBIR) Phase I project will investigate the use of in-situ, real-time film thickness monitoring and in-situ, real-time uniformity manipulation to improve process uniformity of Chemical Mechanical Polishing (CMP). Improved process uniformity will enhance the yield and effectiveness of the CMP process, which is increasingly used as a semiconductor planarization process. Phase I will develop a five-channel, real-time CMP active uniformity control system capable of compensating for center uniformity defects. Individual components will include: opto-electronics, software, five-channel optic access, and a back pressure system. Commercial application of the technology will focus on the CMP process used in semiconductor manufacturing. In addition, other potential applications include micromachining and optical circuit and fine optics production.
