*** 9761140 McKenna This Small Business Innovation Research Phase I project proposes a novel technique for cleaning of semiconductor wafers using Acoustic Coaxing Induced Microcavitation(ACIM). This technique relies on precisely controlling the intensity and location of acoustic microcavitation at a particulate site to dislodge that particulate from the wafer surface. It will be effective for removing even sub-micron particles without damaging the wafer substrate. ACIM is a chemical-free, environmentally friendly process operating in a de-ionized water environment. The objective of Phase I is to establish the feasibility of using ACIM for fine cleaning. Through detailed experiments we will assess the performance of ACIM assisted fine cleaning of post-CMP(chemical mechanical polishing) wafers. The experiments will study the feasibility and provide information for prototype design during Phase II. ACIM assisted cleaning will solve the need for cleaning without damage of precision surfaces, specifically the silicon wafers in semiconductor manufacturing. It is a chemical free, environmentally friendly technique for ensuring ultra-cleanliness with precision and speed unlike other methods available today. ACIM is very cost effective, and easy to implement in the existing infrastructure. ***
