The project involves the development of a facility to enable the design and prototyping of systems that offer a major increase in functionality and performance relative to current generation systems. Performance increases are achieved by developing design tools that apply leading-edge semiconductor and packaging technologies by incorporating fabrication and testing constraints as an integral part of the design tradeoff process, and by developing innovative new hardware/software structures for important classes of systems. The project exploits the projected increases in both complexity and speed of semiconductor technologies due to further decreases in feature sizes and utilizes MCM (Multi-chip Module) packaging technologies to enable system realization .
