A method is proposed to develop metal matrix composites (MMC) with high directional thermal conductivities for use in the electronic components as packaging material to promote heat dissipation. Since thermal management is one of the critical aspects of packaging design, lifetime and performance of electronic components can be increased dramatically if such a material is economically feasible. Such a material could have significant economic impact. The proposed method is to utilize commercially available graphite fibers employing fiber spreading in a pneumatic and liquid flow field, followed by uniform deposition of copper or aluminum on the spread fibers by hollow cathode plasma technique. A thin interface layer of Si or Mo will be applied if necessary, to improve adhesion and better translation of mechanical or thermal properties. The coated fibers will then be weaved or placed in desired architecture and consolidated at 50 to 80% of melting temperature. The resulting material is expected to have high thermal conductivities (600 W/mK) in X and Z directions.
