This is an investigation of the feasibility of depositing hard-to-plate metals from a supercritical fluid and of the fundamental physicochemical phenomena associated with such a process including electrode kinetics, solution conductivity, and dielectric behavior. Initial studies will be on the recently demonstrated process for electroplating aluminum on copper from a supercritical mixture of toluene, ethane, aluminum bromide, and potassium bromide. Electrodeposition of titanium will also be examined. If successful, this approach offers a broad range of possible metal platings with metals possessing desirable properties with respect to electrical conductivity, chemical catalysis, or corrosion resistance. These new materials could find application in a variety of electronic and structural materials applications. Extension of the approach to alloys and semiconductors may also be possible.
