This study concerns the use of excimer lasers in the thermal processing of materials, a technique which can be advantageous in device micro-fabrication. Micro-machining can be achieved by localized ablation and evaporative material removal caused by high powered laser beams. Excimer laser light irradiation can yield submicron pattern dimensions. The development of the technique to a reliable technology depends on the fundamental development of the physics of the material removal process. The primary objectives of this project are: (1) To experimentally analyze the material removal mechanisms by (a) in situ transient optical measurements, (b) post processing analysis using SEM, TEM, and X-ray diffraction. (2) To theoretically model the material removal process. (3) To optimize the process parameters toward the achievement of defect-free submicron patterns in metallic and semi-conductor layers.
