On June 2-6, 2008, State University of New York at Stony Brook (Stony Brook University) will be hosting and co-sponsoring Stony Brook Modeling Week. The Stony Brook Modeling Week comprises two prestigious symposia that are being held consecutively, namely, the annual Solid and Physical Modeling Symposium (to be held on June 2-4, 2008) and the annual International Conference on Shape Modeling and Applications (to be held on June 4-6, 2008). The first of these two conferences, the ACM Symposium on Solid and Physical Modeling (SPM) is co-sponsored by the Association For Computing Machinery Special Interest Group on Computer Graphics (ACM SIGGRAPH). It is an annual international forum for the exchange of recent research results in applications of spatial modeling and computations in design, analysis, simulation, and manufacturing, as well as in emerging biomedical, geophysical, and other relevant areas. The second conference, the International Conference on Shape Modeling and Applications (SMI) is cosponsored by the Institute of Electrical and Electronic Engineers Computer Society (IEEE-CS) and provides an international forum for the dissemination of new computational techniques for modeling and processing digital representations of shapes and their properties to a diverse community of experts across a wide range of areas. These two conferences together traditionally had formed the International Convention on Shapes and Solids in 2004 and 2005, respectively.
