Investigators: Sandip Kundu of University of Massachusetts Kewal K. Saluja of University of Wisconsin ? Madison James E. Smith of University of Wisconsin ? Madison
Proposal Period: June 2008 to May 2010
Summary:
This is a multi-university project. The central idea of the proposal is to develop and use a ?microvisor layer? that resides between operating system and the hardware of a microprocessor. The objective is to provide the desired system performance even when some of the components in the system are unable to meet their specified goals. In particular this study focuses on the use of microviosor layer to protect the processor from overheating or for testing and diagnosis of faults in the processor so as to improve the reliability and availability of a microprocessor and microprocessor based system. The project will quantify the advantages and the cost of implementing such a scheme.
The broader technological and academic impact of this research is availability of results of this research to academia and industry though web share. The results will be of great benefit to the semiconductor industry as the proposal addresses reliability problems that are just around the corner. Innovations will help US competitiveness by producing higher performance, high reliability computing resources at lower cost, thus providing a great socioeconomic benefit to the society.