Elevated temperature is a major problem for the reliability, performance, power consumption, and packaging costs of integrated electronic devices. Temperature is a main physical barrier limiting the performance benefits of future technologies that promise tera-scale integration. To meet the thermal management challenges of future many-core processors, this research program envisions a new class of intelligent dynamic thermal management systems that explore the vast search space of possible control parameter settings and decide the optimal temperature and performance targets. This research program also investigates new cooling system designs that enable the thermal management system to target directly hot spots at the micro scale. Directly targeting hot spots alleviates the thermal constraints on performance.
The proposed research program will lead to transformative solutions and tools that address the fundamental thermal management challenges of computing systems and ensure their scalability. The proposed program will lead to the training of a diverse workforce of undergraduate and graduate students to be well prepared to deal with tomorrow?s thermal management challenges. The educational component of this program includes (1) research experiences for undergraduates; (2) integrated approach to entrepreneurship education with research; (3) hands-on training through the development of educational laboratories based on a state-of-the-art infrared camera; and (4) continuous education through the development of high-quality educational materials and an interactive technical Web site.
