This research is developing a new approach to testing of the next generation Multichip Module (MCM) substrates. The next generation MCM substrates will contain high density interconnects and integrated passives. There are numerous techniques that are being pursued in the packaging industry for MCM interconnect testing. These techniques are limited in the resolution of defect detection and are expensive in terms of test equipment or cumbersome due to test methodology to improve resolution of defect detection and to reduce the cost of testing MCMs. A novel low-cost text technique has been discovered by this investigator for interconnect testing. Based on this discovery, the objectives of this research are: (1) development of electrical models of thin film interconnects and integrated passives; (2) discovery and investigation of a low-cost test technique for integrated passives; (3) develogpement of a parallel membrane probe technique for testing high density interconnects; (4) development of test software tools to locate process defects, and, (5) fabrication of a test vehicle with a thin film MCM substrate to demonstrate and evaluate the success of the research goals.
