This project is on fast and accurate computational techniques for the design of 3D embedded RF components. The numerical method to be investigated is based on a full-wave Mixed Potential Integral Equation formulation that has the capability of providing accurate modeling of 3-D interactions and handling arbitrary multi-layered media with different dielectric constants. Critical mathematical and algorithmic breakthroughs will be explored in the areas of fast calculation of multi-layered dyadic Green's functions over substrate, fast matrix solution of impedance matrices, high order basis functions, and fast frequency sweep techniques. Promising results from our initial investigations indicate that special numerical techniques superior to the techniques used in present software tools can be developed for 3D RF components in multi-layered media, and may lead to significant impact to the design of wireless systems. This project will also provide an opportunity for close interactions among the university team members and National Semiconductor Corporation - the industrial partner. Such an effort will strengthen the graduate education in both engineering and applied mathematics at participating universities, while industry will be benefited by potential fundamental breakthroughs of innovative and exploring research at universities.
