Abstract

A research program for the growth, characterization and testing of copper films for applications in the new generations of electronic devices is proposed. The approach focuses on a CVD process which employs vapor precursors which dissociate at temperatures as low as 150'C. The process is "Low Temperature Metal-Organic CVD," or LTMOCVD.

  Funding Agency

Agency
National Science Foundation (NSF)
Institute
Division of Civil, Mechanical, and Manufacturing Innovation (CMMI)
Type
Standard Grant (Standard)
Application #
9010661
Program Officer
George F. Keyser
Project Start
Project End
Budget Start
1990-07-01
Budget End
1992-06-30
Support Year
Fiscal Year
1990
Total Cost
$70,000
Indirect Cost

  Institution

Name
Suny at Albany
Department
Type
DUNS #
City
Albany
State
NY
Country
United States
Zip Code
12222