The research will apply high temperature Moire interferometry and high temperature digital image correlation to obtain strain and displacement fields in the vicinity of crack tips under high temperature creep loading. THe work will include microstructural examination of damage initiation and growth to develop a better understanding of the physics, at the same time advancing analytical and numerical solutions for the near tip stress-strain fields. The ultimate aim is to develop improved methods for prediction of creep damage in materials and structures.//
