This project will study the feasibility of fabricating microelectronic devices from boron and boron carbide-based materials. The research is based on initial success in the selective area deposition of boron and boron carbide by chemical vapor deposition, using boranes. A number of electronic devices and electronic grade protective coatings will be fabricated by using x-ray lithographic techniques. Boron carbide-based semiconductor devices may be of considerable interest, due to their potential high temperature and radiation-resistant properties. As a result, such devices may work under extreme conditions.
