9812696 Desai This Grant Opportunities for Academic Liaison with Industry (GOALI) research project is the continuation of work on an innovative model and test device for electronic packaging. Several new directions will be undertaken in the integration of laboratory testing, constitutive modeling and computer analysis. A new thermomechanical laser interferometry device has been developed and a series of tests will be performed to gain information on the effects on joining materials, including lead-free materials, of variations in cyclic mechanical and thermal loading. This thermomechanical behavior of the material will be incorporated into the unified constitutive modeling approach using the disturbed state concept (DSC). The preliminary work has demonstrated the validity of the model for simple applications on various solders and silicon. This research project will focus upon characterizing the integration of the modeling and testing to permit future optimization of design and reliability analysis methodology. This project addresses the significant need of having a better understanding of reliability in electronic packaging and the impact upon the microelectronics industry.
