The objective of this research project is to develop the foundation for a novel assembly/disassembly method for micro/meso-scale components. The project will investigate bulk assembly/disassembly of micro- to meso-scale discrete components on a planar substrate using the combination of vibratory palletization for gross positioning and on-substrate micromechanical linear impact actuators for fine positioning and positive fastening and release. The research also aims to demonstrate the potential effectiveness of the method as a bear-chip interconnection means in multi-chip module (MCM) assembly and disassembly. Vibratory palletization will be applied to effectively eliminate the need of sequential pick-and-place style component handling/positioning. The applied high-frequency vibration is intended to overcome sticking among the components, handling devices, and substrates. The micromechanical linear impact actuators will be selectively activated also by external vibration, to provide fine positioning and positive fastening and release of the components. The integration of an array of palletizing features and linear impact actuators on a common substrate is intended to realize a bulk assembly/disassembly method suitable for micro electromechanical applications. Successful completion of the research will provide the enabling knowledge for bulk assembly and disassembly of micro/meso-scale components amenable for automation. The method will advance the current microelectrical and MEMS fabrication technology by dramatically increasing the number of combinable fabrication processes and materials and by improving the system reliability through increased subsystem modularity.
