This International Symposium on Nondestructive Characterization of Materials has been held in three different countries at intervals varying 3 to 1 years. This 6th symposium will be held in Oahu, Hawaii on June 7-11, 1993. It has an International Organizing Committee of 13 members from 5 countries. The complete program includes sessions on Electronic Component Nondestructive Characterization & Evaluation; Biomimetic and Biotic Materials; Interfaces; Nondestructive Characterization for Process Control; and Verification of Materials Processing Models. %%% This International Symposium on Nondestructive Characterization of Materials will be the sixth symposium, held in three different countries at time intervals varying from one to three years. It provides a forum for active scientists and engineers to exchange the recent advances in their respective fields. It is also a forum for the materials researchers and the nondestructive testing researchers to exchange information and to promote understandings.
