Plasma etching has become an invaluable tool in the fabrication of modern microelectronic integrated circuits, making possible the high packing density of electronic components that has become standard in modern circuitry. Many colleges and universities offer laboratory courses designed to give undergraduate students "hands-on" experience with fabricating microelectronic components. However, these courses ignore plasma etching in favor of the easier, but no longer industrially useful, wet-chemical etch methods, leaving the graduating engineer with limited knowledge and no practical experience in plasma processing of semiconductors. This project incorporates experimental work in the undergraduate microelectronics laboratory designed to give students a knowledge of basic plasma processing equipment, to teach students techniques for etching semiconductor materials, and to facilitate the students' understanding of fundamental plasma processes and diagnostic techniques. Diagnostic tools suitable for use in an undergraduate laboratory allow the student to understand the processes taking place in the plasma, as well as to evaluate the results of plasma etching of materials. Using this equipment, students perform a series of experiments learning the characteristics of rf plasma systems, perform some easy diagnostic studies, and evaluate the results of etching of various semiconductor materials. A relatively modest capital expenditure provides the student with an in-depth knowledge of plasma etching, and its implementation in the semiconductor industry.

Agency
National Science Foundation (NSF)
Institute
Division of Undergraduate Education (DUE)
Type
Standard Grant (Standard)
Application #
9151962
Program Officer
Duncan E. McBride
Project Start
Project End
Budget Start
1991-08-01
Budget End
1994-07-31
Support Year
Fiscal Year
1991
Total Cost
$25,525
Indirect Cost
Name
University of New Mexico
Department
Type
DUNS #
City
Albuquerque
State
NM
Country
United States
Zip Code
87131