The integration of micromechanical devices on silicon chips is an emerging technology. Micromechanical devices, including actuators, motors, and sensors, are projected to have applications in robotics, instrumentation, medical probes, space-based systems, and sensor arrays. Recent research results have shown that moving parts, such as gears, linkages, and motors, can be fabricated using modified silicon processing techniques. The proposed research seeks to develop a CVD tungsten-on-silicon technology to fabricate fully released, movable microstructures for actuators and motors. Specifically, the goals of this research include: (1) to develop a tungsten-silicon technology to produce stress-free, movable microstructures, (2) to fabricate a linear, electrostatic actuator with 10 micron travel using the tungsten-silicon technology, (3) to fabricate test structures to measure and characterize friction and stress for tungsten-silicon microstructure systems, (4) to fabricate a linear micromotor, and (5) to identify the key science and technology issues for future research and development of microelectromechanical systems.
