This research will explore the use of single-sided bulk- silicon process technology for the realization of microelectromechanical systems (MEMS). Efforts on fundamental materials characterization, the development of new microstructure formation techniques, and the development of generic modeling and simulation capabilities for MEMS will be conducted. Research results will be applied in the fabrication of two- and three-dimensional devices, including electrostatically driven linear micromotors, laterally driven resonant microstructures, and microvalves. One device that will be considered is a fully integrated scanning thermal profilometer (STP) that operates using laterally driven resonant structures fabricated from bulk silicon. The STP will incorporate an integrated polysilicon metal thermocouple for temperature measurement, a submicron silicon tip supporting the thermocouple, electrostatic drive mechanisms, and a chip-level package realized by stacking multiple silicon levels to protect the STP from particulates and physical damage. The technology resulting from this research should complement surface micromachining techniques to extend the field of MEMS and realize new structures.
