The goal of the proposed work is the development of detailed three-dimensional models of inner lead bonds in TAB devices. The models will be used to determine the effect of various bond defects on mechanical performance of the bond and to determine new experimental approaches to measuring bond quality. The proposed analytical technique relies on finite element analysis and incorporation of analysis developed by other researchers into a phenomenological model. The proposed experimental techniques uses a magnetically driven manipulator to apply a well controlled shear force at precise locations of the bond.
