This is a Presidential Young Investigator award. The research it supports will seek to improve microfabrication technology and its application to the creation of novel sensors, actuators, and electronic devices. The specific research involves the use of silicon wafer bonding technology for fusing single crystal silicon wafers. This includes fundamental studies of bond mechanisms and bond strength, and the development of characterization tools for studying bond quality. Research will also include applications to microsensors, microactuators, microelectronics, and packaging.
