9512662 Liu This award is for a two year cooperative research project between Dr. Sheng Liu, Florida Institute of Technology, and Dr. Yang Wei, Tsinghua University, Beijing, China. The proposed work expands research funded under MSS 9310085 on damage tolerance in microelectronic packaging to include collaboration with Tsinghua University where Professor Yang is engaged in research on micromechanics modeling, testing and failure prediction. Under this project researchers will conduct experimental and analytical studies on material response and interfacial strength followed by damage tolerance analysis. The work is experimental and computational in nature, and addresses an important technological problem in the microelectronics industry.
