The goal of this collaboration between the PI and Peter Markwich of the Technische Universitªt in Berlin is to advance the state of mathematical modeling to accommodate the rapid advances in miniaturization of semiconductor devices. The computer simulations derivable from the mathematical models are used to optimize process and device parameters, thereby reducing the number of faulty chips, and increasing throughput on the assembly line. Some existing models are unable to describe all of the features of cutting- edge technologies, while others are too complex computationally to be practical. This proposal seeks to use a linkage of models using techniques of asymptotic analysis. The research will yield new, hybrid models which represent a compromise between physical relevance and computational feasibility.
