This Small Business Innovation Research (SBIR) Phase II project will build a small form factor silicon chip antenna for radio frequency identification (RFID) applications in smart tags. A new high-performance, low cost, small size silicon chip antenna, fabricated by wafer batch processing, will be combined with a standard, passive (no battery) RFID chip to form a low cost, high-performance RFID tag of small dimensions. The antenna and the RFID chip are stacked directly on top of each other. Phase I used a simplified process and scaled up structures. In Phase II the process will be optimized, devices with the intended dimensions will be used, and the antenna chip and the RFID chip will be stacked.
Passive RFID systems are used in applications such as object tagging, asset management, hazardous materials tracking, and tracking of important documents. Existing RFID technology is limited by the need for large transponder antennas (~ 1 inch by 2 inch minimum) and costly multi-component assembly. The silicon wafer batch processed antenna chip technology will produce millimeter-scale smart tags (programmable replacement for bar codes), enabling products for large commercial markets.
