This Small Business Innovation Research (SBIR) Phase II project will develop an innovative low-cost W-band (70-80 GHz) single chip transceiver using the metamorphic wafer technology developed in Phase I, and efficiently integrating the various MMIC components. The low cost non-electronic beam FET processes, MM HEMTs, and initial chip designs developed in Phase I will be used for the development of the fully integrated transceiver in Phase II. The resulting new technology will enable the MMW industry to be cost effective to expand the commercial market to achieve the low cost and high performance required in the industry.

This project will enable enhanced performance and low cost consumer compatible volume production of automotive collusion avoidance radar systems, MMW tracking systems, and security radar and detection systems.

Project Start
Project End
Budget Start
2003-11-15
Budget End
2008-10-31
Support Year
Fiscal Year
2003
Total Cost
$1,209,126
Indirect Cost
Name
Tlc Precision Wafer Technology
Department
Type
DUNS #
City
Minneapolis
State
MN
Country
United States
Zip Code
55411