This is a SBIR Phase I project to develop a non-destructive instrument for measuring the thermal conductivity and interface thermal resistance of thin films utilized in electronic components. Previous methods of making these measurements were difficult, time consuming, and not amenable to in-situ measurements of components. This method is applicable when the films are deposited on high thermal conductivity substrates, and a set of three to four coatings, each with a different and known thicknesses, are applied. The temperature-time history of a sample is taken when suddenly placed in contact with point heat source, and this history is compared with the results obtained from a substrate of known thickness and thermal conductivity, and utilizing the results of an analytical developed at the University of Rochester. The development and commercial availability of a nondestructive for thermal conductivity and interface thermal resistance in dielectric and other thin films will permit rapid advances to be made in the design and construction of multilayer structures with improved heat flow characteristics. It also will be a useful diagnostic tool in semiconductor defect detection and quality control.
