Poor adhesion of thin-film metals and dielectrics to diamond surfaces currently impedes the development of diamond in active and passive electronics applications. The origin of the poor adhesion is the chemical nature of the diamond surface. The kinetic stability and electronic structure of the diamond surface limit low-temperature formation of robust interfaces. However, by chemically modifying the surface of diamond, the formation of robust interfaces may be enhanced. Advanced Technology Materials, Inc. has discovered a novel photochemical method to introduce a wide array of new chemical functionality to the surface of diamond. Preliminary characterization of the chemically-modified diamond surface suggests improved adhesion of metals. In Phase I they will expand the range of diamond surface photochemical reactions and measure the effects of surface modification on adhesion and electrical contact properties. In Phase II they will apply the technology of photochemical surface modification to the development of diamond electronic devices, including diodes, cold cathodes and charged-particle detectors.
