Conventional techniques for accelerometers yield micromechanical structures whose sensitive axis is perpendicular to the surface of the wafer. There is a need for new micromechanical designs and new transduction techniques which allow the sensitive axis of the microstructures to lie in the plane of the wafer in order to measure six degrees of freedom. A new optical transduction technique and a new micromechanical design are illustrated which allow the sensitive axis to lie in the plane of the wafer and which eliminate cross-talk. This has the advantage that several structures can be integrated monolithically in the same wafer with multidegrees-of-freedom measurement capability. The sensor incorporates a polymer waveguide and is fabricated with the use of laser ablation of materials. The major task is to develop a fabrication process which is compatible with the characteristics of all the materials utilized. A comprehensive study of all the pertinent process parameters affecting the performance of the polymer waveguide will be conducted.
