ABSTRACT EEC-9727260 RINGO This Research Opportunity Award (ROA) funds a two year project for a researcher from Gonzaga University (RUI/PUI) to work with the University of Washington research site of the Industry/University Cooperative Research Center for Design of Analog/Digital Integrated Circuits located at Washington State University. The project is entitled, "Modeling Thermal and Electro-thermal Behavior Integrated Circuit Devices." The study will address numerically solving the heat transfer problem for a "generic" integrated circuit investigating the effects of the geometry, material properties, and boundary/initial conditions on the temperature response.

Agency
National Science Foundation (NSF)
Institute
Division of Industrial Innovation and Partnerships (IIP)
Type
Standard Grant (Standard)
Application #
9727260
Program Officer
Alexander J. Schwarzkopf
Project Start
Project End
Budget Start
1997-10-01
Budget End
2000-06-30
Support Year
Fiscal Year
1997
Total Cost
$50,000
Indirect Cost
Name
Washington State University
Department
Type
DUNS #
City
Pullman
State
WA
Country
United States
Zip Code
99164