Advanced CMP Products Inc. will develop a unique wafer to wafer transfer capability for micropackaging technology, based on a technique known as tethered transfer. This process has demonstrated high yield and hermetic capability, and can transfer complex devices such as micromechanical resonators. The process is tolerant of substrate asperities and particulate contamination, and does not subject target components to high temperatures or agressive chemistries. The proposed concept is relevant to a $1.2B market for microfabricated packages in wireless telecommunications, consumer electronics and other industry sectors.
